High Performance Thermal Paste Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. High Performance Thermal Paste Suitable for CPU, chipsets on Mainboard, VGA card, etc. Easy to use. Zif Socket Templates ensure correct applying area with various CPU socket types. Produces an even layer when using applicator. Dielectric. Wide range of application temperature. Specifications Product Number HTK-002-U1 Color White Thermal Conductivity 0.8 (W/meter- °C) Specific Gravity 2.37 Volume Resistivity 5.0 x 1015 Dielectric Constant 4.4 at 100k Hz Dielectric Strength 550 volts/mil, 21.7 kV/mm Dissipation Factor 0.02 at 100k Hz Viscosity / Flowability Nonflowing Cooler Type Thermal Grease Series Thermal Grease
